Stress Screening & Thermal Shock Chambers from Cincinnati Sub Zero

      

Stress Screening & Thermal Shock Chambers

Cincinnati Sub-Zero environmental screening systems are capable of producing optimum stress levels for detecting latent product flaws by stimulating defects at the lowest level of assembly, before they get into the field. The return on investment in both actual savings and customer confidence adds greatly to the value of electronic assemblies screened in a CSZ thermal shock system.

Unique chamber designs pay particular attention to air flow, passing equal volumes of conditioned air over the products, resulting in rapid product temperature changes. The thermal stresses induced precipitate hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.

Stress Screening & Thermal Shock Chambers

VTS-SeriesThermal Shock, Air-to-Air Chambers

The VTS Air-to-Air Thermal Shock Chambers are designed to perform tailored environmental stress screening of component and board level electronic assemblies. The VTS Chamber will also perform as a fully functional, independent environmental test chamber.

The VTS-Series Chambers can be specially designed to meet the unique requirements of the following specifications: MIL-STD 883C, Methods 1010.5 and 1010.7; MIL-STD 202F, Method 107G; and MIL-STD 810D, Method 503.2.

VTS-Series Thermal Shock Specifications

DTS-Series Thermal Shock, Air-to-Air Chambers

The DTS Air-to-Air Thermal Shock Chambers are designed to perform tailored environmental stress screening of component and board level electronic assemblies. The DTS design is convenient for large components and in manufacturing environments.

The DTS-Series Chambers can be specially designed to meet the unique requirements of the following specifications:MIL-STD 883C, Methods 1010.5 and 1010.7; MIL-STD 202F, Method 107G; and MIL-STD 810D, Method 503.2.

DTS-Series Thermal Shock Specifications

TSB-Series Thermal Shock, Liquid-to Liquid Baths

Designed to meet the requirements of MIL-STD 883C, Method 1011, Conditions A, B, and C. Liquid thermal shock chambers are complete with microprocessor, dual channel controller, and energy saving non-bucking refrigeration system.

The CSZ exclusive vapor-tight stainless steel construction dramatically reduces the evaporation and fluid loss usually associated with liquid thermal shock equipment, lowering operating costs over the life of the system.

TSB-Series Thermal Shock Specifications